Wunschzettel

Thermal Interface

Ensure the lowest thermal resistance with our award-winning thermal interfaces. Well known for its outstanding quality, our high-performance MX thermal compound is a regular winner in performance tests. It offers a very low thermal resistance due to its minimum bond line thickness and is easy to apply, even for beginners. Thermal pads in various designs and sizes round out the product range.

Filter

Show results
Sort by
Thermal Pad - APT2560
High Performance Thermal Pad

US$19.99

Prices incl. VAT plus shipping costs
Tip
MX-5
ULTIMATE Performance Thermal Paste

US$14.99

Prices incl. VAT plus shipping costs
MX-2
PERFORMANCE Thermal Paste

US$7.99

Prices incl. VAT plus shipping costs
Thermal Pad - APT2012
Pack of 4 pieces

US$15.99

Prices incl. VAT plus shipping costs
MX-4
PREMIUM Performance Thermal Paste

US$11.99

Prices incl. VAT plus shipping costs

1. What heat conducting materials do we offer and how do they differ?

ARCTIC primarily offers two types of thermal interfaces: thermal paste and thermal pads.

Thermal paste

Thermal paste consists of two basic components: a carrier substance and a heat conducting filler, usually both non-conductive and non-capacitive. Metals like aluminium or copper are fabulous heat-conductors. Unfortunately, they are also electrical conductors, potentially capacitive and thus the use of metal fillers is associated with risk.

Non-electrically conductive thermal paste offers a thermal conductivity of 1 to 4 W/mK. Much higher values are often advertised, but are complete nonsense.

Despite its low thermal conductivity, paste is the best choice if both surfaces are smooth and flat because the compound can be squeezed to a very thin bond line. More interesting is the thermal resistance of a TIM (thermal interface material), as this takes into account both the bond line thickness and the thermal conductivity.

Thermal Pads

Thermal pads generally conduct heat better than thermal paste (typically 1 to 7 W/mK). Due to their consistency; they are suitable for filling larger gaps where a very thin bond line is not possible.

Typically, harder pads conduct better than softer pads. Thus, harder pads are more suitable for high heat density application and softer pads are the better choice in case of large dimensional tolerance.

Thermal Resistance = Bond Line Thickness / Thermal Conductivity

 

Delta T (Temp difference between CPU and Cooler) = Thermal Resistance x Energy (to be transferred from CPU to Cooler)

2. How do I apply thermal paste correctly?

Instructions on how to apply thermal paste can be found here:
 
 
 
 

3. What should you watch out for when using the thermal pads?

Users should choose a soft enough thermal pad so that it adapts well to the surfaces (i.e., component and cooler) and thick enough so it fills the gap between the surfaces and gets between 10 % and 40 % compression. I.e., use a 1.0 mm pad to bridge a 0.7 mm gap.

General Rules:
  • The TIM layer should be as slim as possible.
  • Layering different pads (or other TIM materials) is possible, but should only be done if the irregularities or tolerances of both surfaces require it to bridge such a gap.
  • If a big gap needs to be bridged, do this with a copper or aluminium plate and use a thin thermal pad on each contact surface. I.e., to bridge a 4 mm gap, use a 3.3 mm Cu plate with two 0.5 mm thermal pads.